Calyos et 2CRSi Edge s'associent pour apporter le calcul IA au plus près du terrain

Charleroi, Belgium, and Manchester, United Kingdom, June 11th, 2026 – As demand for high-performance AI infrastructure continues to expand beyond traditional data centers, 2CRSi (ISIN code: FR0013341781), via its subsidiary 2CRSi Edge and Calyos announce a technical collaboration focused on integrating passive two-phase cooling technologies into high-density computing platforms designed for deployment in constrained and non-controlled environments.  

High-performance computing systems are becoming critical infrastructure for both civilian and defence applications. However, increasing compute density—particularly with next-generation GPU platforms—creates significant thermal and energy constraints, limiting deployment in edge, mobile, or harsh environments.  

Cooling can account for a substantial share of total system energy consumption, while also introducing complexity through pumps, fans, and liquid loops. Addressing these limitations has become a key requirement for enabling resilient, energy-efficient, and deployable systems, such as AI platforms.  

A Complementary Technical Approach  

2CRSi contributes its expertise in the design and manufacturing of high-performance, energy-efficient computing systems and 2CRSi Edge contributes its expertise in design and manufacturing of ruggedized GPU platforms engineered to operate outside traditional data centers.  

Calyos, currently part of the NATO DIANA 2026 Energy & Power Challenge, develops passive two-phase cooling technologies originally derived from space applications and now deployed across automotive, energy, computing and defence sectors.  

This collaboration combines both capabilities to address the challenges of operating high-density AI workloads in environments where traditional cooling infrastructure is inefficient.  

Integration of Passive Cooling into High-Density GPU Platforms 

The joint development focuses on integrating Calyos’ passive two-phase direct-to-chip cooling architecture into computing platforms, enabling support for next-generation high density AI hardware to operate at the edge.  

The resulting architecture leverages:  

• Evaporation at chip level to absorb heat directly from high-power components 
• Passive condensation and fluid return within a closed loop system  
• Elimination of pumps, compressors, and high-speed fans 

By enabling efficient heat transfer and stable thermal operation, this approach supports uninterrupted AI-driven mission operations for armed forces and in other constrained environments.  

System-Level Benefits for rugged computing 

The combined solution provides several key system-level characteristics:  

• Improved reliability: absence of mechanical pump reduces failure modes and maintenance requirements  
• Reduced acoustic and thermal signature: minimal airflow and controlled heat rejection footprint, suitable for sensitive or confined environments 
• Reduced energy overhead: lower cooling-related power consumption compared to conventional air-cooled or active liquid-cooled systems  
• Compact and rugged integration: deployment within transportable, shock- and vibration-resistant enclosures  

As a result, high-density GPU systems can operate at sustained performance levels without thermal throttling, including in sealed, low-airflow or high-ambient-temperature environments . 

Enabling New Deployment Scenarios for Dual Use AI infrastructures 

This collaboration enables deployment of AI computing capabilities in environments where conventional infrastructure is impractical:  

• Defence and security operations requiring low-signature, deployable systems  
• Industrial edge computing in thermally constrained environments  
• Mobile or containerized data centers  
• Critical infrastructure and remote sites, where reliability and low maintenance are essential  

By removing dependency on conventional HVAC and plumbing systems and reducing thermal constraints, Calyos and 2CRSi Edge enable data centre-class performance closer to the point of use.